IC Test System, Type 1. Semiconductor industry. Automated pick and place
transfer line through three sequential, adjacent environmental test heads,
thoroughly tests critical automobile airbag initiator IC devices. The three
temperature chambers are custom designed to pre-heat or pre-cool the DIP devices
to -40C, +80C and ambient. Each test head is attached to shaker table coils to
vibrate the devices under test. Multiple pick and place robots transfer devices
through the test areas and back into tubes after sorting. Interface to testers
and vibratory shaker system. Final section provides laser mark of components.
Installed in South Korea.
Board Loader. Chip manufacturer. Two high speed gantries share the same
workspace to unload Jedec trays of 32-pin TSOP chips, and place 4 at a time into
4 burn-in test cards, each with 64 sockets. Interfaces with 4 Novtek cyclers and
server over Novell network. Automated tray stacker mechanism allows loading and
unloading of process trays without interrupting the operation. Other systems
have been built for SOIC and DIP chips, and integrating automated tube stackers
TSOP Programming System.
Cellular phone manufacturer. Input pick and place system loads 16 programmable
32-pin TSOP's into precisor plate. Next station loads all 16 devices into
programming sockets. Last section removes all 16 chips back into Jedec trays.
IC Test System, Type 2. Semiconductor industry. Automated conveyor line
through three sequential, adjacent environmental test chambers, with pick and
place robotics, thoroughly tests critical automobile airbag initiator IC
devices. The three large chambers are set at -40C, +80C and ambient. Each
chamber also uses enormous shaker table coils to vibrate the devices under test.
Automation passes trays full of up to 100 devices each, still in ceramic chip
form, into special fixtures and then vibrates and simultaneously tests at
temperature for up to 45 minutes. Component selection of pneumatic and conveyor
components critical in this environment. Interface to host computer system via
IC Programmer. Chip programming applications. This is a system to
automatically program a variety of fine-pitch device packages for programmable
IC's. It was developed primarily to handle fine-pitch packages such as TSOP,
SOIC, TQFP. There is a single X,Y,Z Theta (rotation) gantry with a single
suction cup, and the mechanism includes a socket opening mechanism. We can use
Jedec trays or tubes or tape and reel. Options include machine vision chip
registration, tape and reel options, laser marker option, programmed chip
serialization, network access. Under exclusive license to Data I/O
Off-Line Binner/Sorter. Supplies binning and sorting capability to a
semiconductor test floor off line and away from the test handler. High speed
system handles various types of trays simultaneously. Transfers 4 fine pitch
devices at once using data from a host plant computer over TCP/IP SECS.
IC Programmer & Laser Mark
Handler. Chip programming applications. This is a system to automatically
program and laser mark a variety of programmable IC's. It was developed
primarily to handle fine-pitch packages using a precision pick and place
approach. There are two independent Z axis suction cups on the gantry, and each
also has a socket opening mechanism. Two heads are used to enable very quick
device swapping by pick up of an existing chip, then immediate placement of a
new chip. Use Jedec trays or tubes. Anybody's programmer can be utilized, and
the most common are already integrated. The laser will mark any size part with
any data or graphic.
Hermetic Leak Test Handler. Semiconductor industry. Fully automated test
system involves the operation of 3 sealable and heated test cells that sniff for
residual chlorofluorocarbon fluid of pin grid array (PGA) semiconductor packages
(hermetic leak test techniques), then correlates measured values to hermeticity
leakage. Automation accepts continuously fed top stacked Jedec trays full of
PGAs and loads each into the machine. A high-speed pick and place unit
vacuum-picks four PGAs at a time and places them into a test cell, closes the
cell and begins the heating, vacuum and sniff test sequence. Class 100 clean
room compatibility, anti-static materials and attention to smoothed motion
parameters allows full production of 80486 chips through this machine. System
sorts completed PGAs back into trays. Prototype system also developed.
Toxic Gas Analyzer Electronics Package. Semiconductor
industry. Full electronics automation package for integrating a modified gas
flame spectrophotometry analyzer to sensing ppb levels of phosphine, arsine and
diborane. Multiplexing sequencer sniffs up to 32 programmed environmental ports
for dangerous levels of semiconductor process gas. Activates alarms and printed
tape indicating alarm levels and conditions. Full diagnostics and computational
self-calibration. Linked with HP-85 desktop computer via GPIB. Host computer
interface available. Used as the world-wide semi standard for arsine processing
based on super sensitive alarm indications of ppb level amounts.
Hot Bath Cleaner. Semiconductor industry. Fixture to heat
a small liquid bath of fluorocarbon used in cleansing electronic hybrid modules.
Unit tray rotates and has automated liquid fill and drain functions. Temperature
control within +-1 deg. C.
Gas Cabinet Controller.
Semiconductor industry. Complete electronics package for the control of a toxic
gas safety cabinet. Used to monitor and control the purging of system
components, replacement of gas cylinders, and all safety aspects. Certain
critical circuit areas are redundant. LCD display, keyboard entry, daisy-chain
capability, host PC AT accessible, bi-color LED lamps at front panel. Designed
and produced as an OEM product. Used in semiconductor facilities in the
distribution of highly toxic and pyrophoric gases such as silane, arsine,
phosphine and diborane.
Facility Gas Distribution System. Semiconductor industry.
Complete control system for an entire semiconductor processing facility used in
the delivery of pyrophoric silane gas. System includes four redundant gas panel
control boxes at an outside gas bunker, away from the facility. Controlled
purging and replacement of silane gas cylinders, as well as control of delivery
pressure and monitoring of all safety devices and alarms. Units configurable
automatically for taking over in the event of low pressure at a supplying
cylinder and switching to a new cylinder. Second system of Zone Cabinets within
the facility further multiplexed and distributed the gas to various process
equipment by providing these same operational features at the point of use.
Computerized technology at all control areas.
Lead Frame Kapton Taper. Semiconductor industry. Fully automated dual Kapton
tape applicator to various lead frames. Punch and die technique maximizes tape
use. Linear transfer-through of frames via precision step-motors and
registration of frame at each station. Heated, temperature controlled lower
blocks. All machine parameters adjustable. Tamper end station.
B-Stage Epoxy Fabricator. Semiconductor industry. Fully
automated machine accepts plastic gridded pallets full of metal VLSI IC lids,
X-Y stage vacuum picks individual lids and places onto rotary index table.
Successive stages contact lid and provide fast preheat. Specialized punch and
die, along with French cutter, forms patterned adhesive from epoxy ribboned
strips in reels. Reel take-up mechanism provides proper pulling torque to
mechanically sensitive epoxy material. Die places epoxy tape on package, then
other rotary stages begin cool down. Pick and place back into trays.
FPGA Programmer Handler.
Semiconductor industry. High speed gantry handler removes QFP devices from Jedec
trays and places into 40 programming sockets. Interface with UNIX Sun
workstation via PC NFS and network to program up to 40 devices simultaneously.
Dual vacuum pick-up cups increase throughput. Speed to 80ips, placement
resolution to 1 mil. Class 100 clean room use. Can be set-up for various device
sizes and grids of Jedec trays, as well as tube-to-tube use. Tray indexing and
transfer stations allow top load operator stacking of Jedec trays.
Heat Sink Attacher. Semiconductor industry. Proprietary
machine for very high speed loading of VLSI IC heat sinks for attachment to IC
packages. Through-conveyors accept pallets holding components; fast pick and
place mechanism transfers heatsink to device.
Lead Frame Handler and Stacker. Accepts completed die cut
lead frames from punch press, stacks them, then transports to a cassette on a
conveyor. Operator loads empty cassettes on one side of conveyor and receives
cassettes loaded with stacked lead frames on the other side. Precision handling
to avoid marring or denting delicate copper lead frames.
HT-1110 Automated Inker is
designed to mark the defective areas of a silicon wafer for semiconductor
Ultrasonic Tester. OEM product for handling assembled semiconductor lead
frame strips with an ultrasonic non destructive underwater test system.
Singulates a lead frame strip from a stack, and places into a fixture
underwater. After testing, removes the strip, dries it, marks it and restacks
On-Line IC Programmer.
Telcom, personal computer, and network products are just some of the assembly
line applications for this system. Linked directly into Universal SMT
equipment. By communicating directly with a factory network, the unit can
anticipate and program a unique code into each IC and deliver it to
standard surface mount equipment.